Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13073423Application Date: 2011-03-28
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Publication No.: US08441125B2Publication Date: 2013-05-14
- Inventor: Takeshi Yuzawa , Masatoshi Tagaki
- Applicant: Takeshi Yuzawa , Masatoshi Tagaki
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2005-208666 20050719
- Main IPC: H01L23/498
- IPC: H01L23/498

Abstract:
A semiconductor device, including: a semiconductor layer having an active region; a first conductive layer formed above the semiconductor layer and having a first width; a second conductive layer connected to the first conductive layer and having a second width smaller than the first width; an interlayer dielectric formed above the semiconductor layer; an electrode pad formed above the interlayer dielectric and covering the active region when viewed from a top side; and a forbidden region provided in the semiconductor layer in a specific range positioned outward from a line extending vertically downward from an edge of at least part of the electrode pad. A connection section at which the first conductive layer and the second conductive layer are connected is not provided in the forbidden region.
Public/Granted literature
- US20110169161A1 SEMICONDUCTOR DEVICE Public/Granted day:2011-07-14
Information query
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