Invention Grant
- Patent Title: Distributed power delivery scheme for on-die voltage scaling
- Patent Title (中): 用于片上电压缩放的分布式电源传输方案
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Application No.: US12824134Application Date: 2010-06-25
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Publication No.: US08441149B2Publication Date: 2013-05-14
- Inventor: Malay Trivedi , Tong H. Kim
- Applicant: Malay Trivedi , Tong H. Kim
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H02J1/00
- IPC: H02J1/00 ; H01H9/54

Abstract:
A high-speed low dropout (HS-LDO) voltage regulation circuit suitable to enable a power gate unit to produce a variable voltage signal based on the load of a processor is disclosed herein. In various embodiments, selection logic may dynamically enable or disable the HS-LDO circuit to allow the power gate unit to operate under a fully-on or fully-off mode. Other embodiments may be disclosed or claimed.
Public/Granted literature
- US20110316339A1 DISTRIBUTED POWER DELIVERY SCHEME FOR ON-DIE VOLTAGE SCALING Public/Granted day:2011-12-29
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