Invention Grant
- Patent Title: Substrate transfer method and apparatus
- Patent Title (中): 基板转印方法和装置
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Application No.: US12820417Application Date: 2010-06-22
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Publication No.: US08441618B2Publication Date: 2013-05-14
- Inventor: Masahiro Nakaharada , Naruaki Iida , Katsuhiro Morikawa , Suguru Enokida
- Applicant: Masahiro Nakaharada , Naruaki Iida , Katsuhiro Morikawa , Suguru Enokida
- Applicant Address: JP Minato-Ku
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Minato-Ku
- Agency: Burr & Brown
- Priority: JP2009-148099 20090622
- Main IPC: B65H1/00
- IPC: B65H1/00 ; G03B27/32 ; G03B27/42 ; G03B27/58

Abstract:
A substrate transfer apparatus, for transferring a substrate from a first module to a second module, includes a moving base having a Y-motion axis for moving the moving base in Y-direction, and a substrate holding member mounted to the moving base via X-motion axis so as to move relative to the moving base to be in an advanced position and a retracted position relative to the moving base. The X-motion axis operates when the Y-motion axis is operating, if the X-motion axis must be parallel to the Y-motion axis when transferring the substrate from the substrate holding member to the second module.
Public/Granted literature
- US20100321648A1 SUBSTRATE TRANSFER METHOD AND APPARATUS Public/Granted day:2010-12-23
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