Invention Grant
- Patent Title: Data center module
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Application No.: US12981124Application Date: 2010-12-29
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Publication No.: US08441789B2Publication Date: 2013-05-14
- Inventor: Hsi Sheng Wu , Hsu Cheng Chiang , Kuo Shu Hung , Kuel Ker Sun
- Applicant: Hsi Sheng Wu , Hsu Cheng Chiang , Kuo Shu Hung , Kuel Ker Sun
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Rabin & Berdo, P.C.
- Priority: TW99137335A 20101029
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A module for data center is presented, which is used for heat sinking of a heat source. The module for data center includes a first chamber, a second chamber, and a heat pipe. The heat source is positioned in the first chamber. The second chamber is adjacent to the first chamber. In addition, the heat pipe has an evaporation end positioned inside the first chamber and a condensation end positioned inside the second chamber. The heat pipe absorbs the heat energy in the first chamber with the evaporation end, transfers the heat energy to the condensation end, and eliminates the heat energy with the condensation end.
Public/Granted literature
- US20120106073A1 DATA CENTER MODULE Public/Granted day:2012-05-03
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