Invention Grant
- Patent Title: Electrical power substrate
- Patent Title (中): 电力基板
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Application No.: US11795276Application Date: 2006-01-16
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Publication No.: US08441796B2Publication Date: 2013-05-14
- Inventor: Robert Morse
- Applicant: Robert Morse
- Applicant Address: GB Cambridge
- Assignee: Keronite International Limited
- Current Assignee: Keronite International Limited
- Current Assignee Address: GB Cambridge
- Agency: Shumaker & Sieffert, P.A.
- Priority: GB0500878.4 20050115
- International Application: PCT/GB2006/000128 WO 20060116
- International Announcement: WO2006/075176 WO 20060720
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
An electrical power substrate comprises a metallic body at least one surface of the body having a coating generated by plasma electrolytic oxidation (PEO). The coating includes a dense hard layer adjacent the said surface of the metallic body, and a porous outer layer. Electrically conductive elements are attached to the said coating.
Public/Granted literature
- US20080257585A1 Electrical Power Substrate Public/Granted day:2008-10-23
Information query
