Invention Grant
- Patent Title: Retaining facility for printed circuit boards on curved surfaces
- Patent Title (中): 弯曲表面印刷电路板的固定设备
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Application No.: US12415358Application Date: 2009-03-31
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Publication No.: US08441803B2Publication Date: 2013-05-14
- Inventor: Bernd Beyer , Horst Friesner , Markus Hemmerlein , Florian Hofmann , Helmut Repp , Wolfgang Schnitzerlein , Markus Stark , Peter Tichy
- Applicant: Bernd Beyer , Horst Friesner , Markus Hemmerlein , Florian Hofmann , Helmut Repp , Wolfgang Schnitzerlein , Markus Stark , Peter Tichy
- Applicant Address: DE München
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE München
- Agency: Lempia Summerfield Katz LLC
- Priority: DE102008017155 20080403
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K1/00 ; H05K7/14 ; H05K7/18

Abstract:
A retaining facility for clearance-free fixing of a printed circuit board onto a one-dimensional curved surface is provided. In the direction of curvature of the one-dimensional curved surface, a tensile or compressive force acts on the printed circuit board or on at least one first connection device connected to the latter, with the printed circuit board being bent and pressed onto the curved surface. In this way the printed circuit board is held solidly and with little vibration on the surface even when acted on by centrifugal forces.
Public/Granted literature
- US20090251871A1 RETAINING FACILITY FOR PRINTED CIRCUIT BOARDS ON CURVED SURFACES Public/Granted day:2009-10-08
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