Invention Grant
US08442087B2 Mounting member and semiconductor laser apparatus having the same 失效
具有相同的安装构件和半导体激光装置

  • Patent Title: Mounting member and semiconductor laser apparatus having the same
  • Patent Title (中): 具有相同的安装构件和半导体激光装置
  • Application No.: US12874432
    Application Date: 2010-09-02
  • Publication No.: US08442087B2
    Publication Date: 2013-05-14
  • Inventor: Takumi Tanikawa
  • Applicant: Takumi Tanikawa
  • Applicant Address: JP Moriguchi-shi
  • Assignee: Sanyo Electric Co., Ltd.
  • Current Assignee: Sanyo Electric Co., Ltd.
  • Current Assignee Address: JP Moriguchi-shi
  • Agency: Mots Law, PLLC
  • Agent Marvin A. Motsenbocker
  • Priority: JP2009-213322 20090915
  • Main IPC: H01S5/00
  • IPC: H01S5/00
Mounting member and semiconductor laser apparatus having the same
Abstract:
Provided is a mounting member having a light receiving element, capable of constraining increase in size and of arranging a plurality of laser element portions closer to each other. The mounting member includes three or more electrodes, which respectively include element mounting portions arranged in a first direction, and a light receiving element disposed in a second direction intersecting with the first direction relative to the element mounting portions. The length in the second direction of at least one of the element mounting portions disposed at both ends in the first direction among the three or more element mounting portions is smaller than the length in the second direction of an element mounting portion disposed at an inner position in the first direction among the three or more element mounting portions.
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