Invention Grant
- Patent Title: Headphone
- Patent Title (中): 耳机
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Application No.: US13014194Application Date: 2011-01-26
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Publication No.: US08442258B2Publication Date: 2013-05-14
- Inventor: Tominori Kimura
- Applicant: Tominori Kimura
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Audio-Technica
- Current Assignee: Kabushiki Kaisha Audio-Technica
- Current Assignee Address: JP Tokyo
- Agency: Whitham Curtis Christofferson & Cook, PC
- Priority: JP2010-021826 20100203
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
A headphone including a headband, an ear cup attached to the headband, a baffle plate fixed to the ear cup and having a rib wall at its periphery, an ear pad engaged with the baffle plate, and a gas permeable buffer between the ear cup and the baffle plate, wherein the buffer and the rib wall prevent a reduction in volume of a front air chamber caused by lateral pressure.
Public/Granted literature
- US20110188696A1 Headphone Public/Granted day:2011-08-04
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