Invention Grant
- Patent Title: Specified position identifying method and specified position measuring apparatus
- Patent Title (中): 指定位置识别方法和指定位置测量装置
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Application No.: US11703661Application Date: 2007-02-08
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Publication No.: US08442300B2Publication Date: 2013-05-14
- Inventor: Ruriko Tsuneta , Tohru Ando , Junzo Azuma
- Applicant: Ruriko Tsuneta , Tohru Ando , Junzo Azuma
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, PC
- Priority: JP2006-086857 20060328; JP2006-348745 20061226
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
A specified position in an array structure in which a reference pattern is displayed repetitively through reference pattern counting is identified. In an array structure image, the pattern detection estimating area generated from a starting point, the address of the starting point, and a unit vector are compared with a pattern detected position found in pattern matching with the reference pattern image, to execute pattern counting while determining correct detection, oversights, wrong detection, etc. Array structure images are photographed sequentially while moving the visual field with the use of an image shifting deflector to continue the pattern counting started at the starting point to identify the ending point specified with an address. If the ending point is not reached only with use of the image shifting deflector, the visual field moving range of the image shifting deflector is moved with use of a specimen stage.
Public/Granted literature
- US20070274593A1 Specified position identifying method and specified position measuring apparatus Public/Granted day:2007-11-29
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