Invention Grant
- Patent Title: Forming conductive couplings in medical electrical leads
- Patent Title (中): 在医疗电线中形成导电接头
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Application No.: US12781181Application Date: 2010-05-17
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Publication No.: US08442646B2Publication Date: 2013-05-14
- Inventor: Kevin R. Seifert , Gregory A. Boser , Jonathan A. Hughes , Michael R. Dollimer
- Applicant: Kevin R. Seifert , Gregory A. Boser , Jonathan A. Hughes , Michael R. Dollimer
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Reed A. Duthler
- Main IPC: A61N1/05
- IPC: A61N1/05

Abstract:
An inner surface of a coupling component sidewall forms first and second portions of a cavity of the coupling component. A conductive coupling between an electrode and a conductor of a medical electrical lead may be formed by inserting a segment of the conductor into the first portion of the cavity, crimping the sidewall of the coupling component around the inserted segment, inserting a segment of the electrode into the second portion of the cavity, and welding an edge of the sidewall to the inserted electrode segment. The edge of the sidewall may define a slot, extending between first and second portions of the cavity, or a hole extending through the sidewall. The electrode may be part of an electrode assembly, mounted around an inner insulation layer of the lead, and the conductor may be part of a conductor assembly extending between inner and outer insulation layers of the lead.
Public/Granted literature
- US20110282420A1 FORMING CONDUCTIVE COUPLINGS IN MEDICAL ELECTRICAL LEADS Public/Granted day:2011-11-17
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