Invention Grant
- Patent Title: Medical electrical lead with backfilled electrode sub-assembly
- Patent Title (中): 带回填电极子组件的医用电线
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Application No.: US12627100Application Date: 2009-11-30
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Publication No.: US08442650B2Publication Date: 2013-05-14
- Inventor: Kevin R. Seifert
- Applicant: Kevin R. Seifert
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Reed A. Duthler
- Main IPC: A61N1/00
- IPC: A61N1/00

Abstract:
A medical electrical lead that includes a lead body and at least one tubular electrode sub-assembly positioned over and attached to the external surface of the lead body. The lead body includes at least one elongated conductive element, such as a cable, that is electrically connected to an electrode of the tubular electrode sub-assembly. The tubular electrode sub-assembly includes a tubular liner and an electrode embedded in the outer surface of the liner. In some embodiments, only a portion of the inner surface of the tubular liner is attached to the lead body which may potentially improve flexibility of the medical electrode lead in the area occupied by the tubular electrode sub-assembly.
Public/Granted literature
- US20100137959A1 MEDICAL ELECTRICAL LEAD WITH BACKFILLED ELECTRODE SUB-ASSEMBLY Public/Granted day:2010-06-03
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