Invention Grant
- Patent Title: Dynamic maintenance planning apparatus
- Patent Title (中): 动态维护策划设备
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Application No.: US12792145Application Date: 2010-06-02
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Publication No.: US08442666B2Publication Date: 2013-05-14
- Inventor: Yuuichi Suginishi , Lengyel Attila , Yoichi Nonaka
- Applicant: Yuuichi Suginishi , Lengyel Attila , Yoichi Nonaka
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2009-134174 20090603
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
A dynamic maintenance planning apparatus including a maintenance planning device and a priority calculating device is provided. The maintenance planning device determines a maintenance date and time on and at which the throughput of a manufacturing system is maximum from among possible maintenance dates and times based on a simulation result in which a specific manufacturing apparatus on a manufacturing system is stopped at a specified maintenance date and time, and, for the maintenance at the determined maintenance date and time, specifies a lot whose completion is predicted to be delayed. The priority calculating device calculates a priority of the lot whose completion is predicted to be delayed so as to prevent waiting time of the lot during the maintenance.
Public/Granted literature
- US20100312371A1 DYNAMIC MAINTENANCE PLANNING APPARATUS Public/Granted day:2010-12-09
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