Invention Grant
- Patent Title: Earmuff assembly
- Patent Title (中): 耳罩装配
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Application No.: US13020261Application Date: 2011-02-03
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Publication No.: US08443467B2Publication Date: 2013-05-21
- Inventor: Tsung-Pai Chiang
- Applicant: Tsung-Pai Chiang
- Applicant Address: TW Taipei
- Assignee: Sound Team Enterprise Co., Ltd.
- Current Assignee: Sound Team Enterprise Co., Ltd.
- Current Assignee Address: TW Taipei
- Agency: Bacon & Thomas, PLLC
- Priority: TW97105463A 20080215
- Main IPC: A42B1/06
- IPC: A42B1/06

Abstract:
An earmuff assembly includes a headband consisting of two headband elements each having two constraint lugs bilaterally located on one end and a coupling portion located on the opposite end, the coupling portion of one headband element being inserted through a groove on each constraint lug of the other headband element for allowing adjustment of the length of the headband, two ear cups, two connection devices that connect the coupling portions of the headband elements to the ear cups such that the angular positions of the ear cups are adjustable in the X-axis direction as well as in the Y-axis direction relative to the headband, and a soft fabric material covering the ear cups for optimal wearing comfort.
Public/Granted literature
- US20110119804A1 EARMUFF ASSEMBLY Public/Granted day:2011-05-26
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