Invention Grant
- Patent Title: Substrate processing apparatus
- Patent Title (中): 基板加工装置
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Application No.: US12222653Application Date: 2008-08-13
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Publication No.: US08443484B2Publication Date: 2013-05-21
- Inventor: Yukio Ozaki , Teruo Yoshino , Satoru Takahata , Reizo Nunozawa
- Applicant: Yukio Ozaki , Teruo Yoshino , Satoru Takahata , Reizo Nunozawa
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2007-211497 20070814; JP2008-111680 20080422
- Main IPC: A47L5/38
- IPC: A47L5/38

Abstract:
To automatically purge a transfer chamber by means of inert gas. There is provided a substrate processing apparatus including a controller that performs control so that a transfer chamber 102 connected to a processing chamber 202 for processing a substrate is purged by gas, the controller having a switching unit that switches a function of exhausting the gas in the transfer chamber 102 in a set direction, and a function of circulating the gas through the transfer chamber 102 in an inert gas atmosphere.
Public/Granted literature
- US20090044749A1 Substrate processing apparatus Public/Granted day:2009-02-19
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