Invention Grant
US08443672B2 Low-power shock and vibration sensors and methods of making sensors
有权
低功率冲击和振动传感器以及制造传感器的方法
- Patent Title: Low-power shock and vibration sensors and methods of making sensors
- Patent Title (中): 低功率冲击和振动传感器以及制造传感器的方法
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Application No.: US11652498Application Date: 2007-01-12
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Publication No.: US08443672B2Publication Date: 2013-05-21
- Inventor: Charles Erklin Seeley , Eladio Clemente Delgado
- Applicant: Charles Erklin Seeley , Eladio Clemente Delgado
- Applicant Address: US MD Bethesda
- Assignee: Lockheed Martin Corporation
- Current Assignee: Lockheed Martin Corporation
- Current Assignee Address: US MD Bethesda
- Agency: Withrow & Terranova, PLLC
- Main IPC: G01H11/00
- IPC: G01H11/00

Abstract:
Sensors for monitoring shock or vibration of an object are provided. The sensors include a proof mass, at least piezoelectric device, and an electronic circuit connected to the piezoelectric device. The piezoelectric device generates a current when the proof mass imparts a force on the piezoelectric device in response to the proof mass being subjected to a transient acceleration when the object is subjected to a shock or vibration. The electronic circuit is at least partially controlled in response to the current generated from the piezoelectric device due to the shock or vibration. Embodiments of the sensor provide multi-axis sensing capabilities. Methods of making the sensors and flexible circuits are also provided.
Public/Granted literature
- US20080168840A1 Low-power shock and vibration sensors and methods of making sensors Public/Granted day:2008-07-17
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