Invention Grant
- Patent Title: Optical fiber cutting device
- Patent Title (中): 光纤切割装置
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Application No.: US12010237Application Date: 2008-01-23
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Publication No.: US08443705B2Publication Date: 2013-05-21
- Inventor: Toshihiko Honma
- Applicant: Toshihiko Honma
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JPP.2007-013025 20070123; JPP.2007-204172 20070806
- Main IPC: B26D1/18
- IPC: B26D1/18 ; B26D3/08

Abstract:
An optical fiber cutting device is configured so that a disk-like blade member is moved in a state, in which the blade member is pushed against a glass fiber part of an optical fiber, to form a flaw on a surface of the glass fiber part. The blade member is turned by a feed roller in synchronization with a movement operation of the blade member that rotates by a contact friction force generated when the blade member is put into contact with a contact member fixedly provided halfway a movement path of the blade member.
Public/Granted literature
- US20080178724A1 Optical fiber cutting device Public/Granted day:2008-07-31
Information query
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