Invention Grant
- Patent Title: Mounting apparatus for electronic device
- Patent Title (中): 电子设备安装装置
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Application No.: US12774740Application Date: 2010-05-06
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Publication No.: US08443987B2Publication Date: 2013-05-21
- Inventor: Wen-Tang Peng , Wei Qiu , Bing-Bao Guo
- Applicant: Wen-Tang Peng , Wei Qiu , Bing-Bao Guo
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Main IPC: A47F7/00
- IPC: A47F7/00

Abstract:
A mounting apparatus includes a rack, two positioning members, two retaining members, and two latch members. The rack includes two first supports and two second supports. Each second support defines a plurality of locking holes. The positioning members are configured for attachment to an electronic device and engage with the first supports. The retaining members are configured for attachment to the electronic device and attached to the second supports. Each retaining member defines a through hole. Each latch member includes a first latch component and a second latch component. The first latch component includes two resiliently deformable securing pieces and defines a threaded hole. The securing pieces are received in one of the locking holes to secure the first latch components to the second supports. The second latch components pass through the through holes and are threaded in the threaded holes, to secure the retaining members to the second supports.
Public/Granted literature
- US20110226710A1 MOUNTING APPARATUS FOR ELECTRONIC DEVICE Public/Granted day:2011-09-22
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