Invention Grant
- Patent Title: Apparatus and methods for forming wire bonds
- Patent Title (中): 用于形成引线键的装置和方法
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Application No.: US12062989Application Date: 2008-04-04
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Publication No.: US08444044B2Publication Date: 2013-05-21
- Inventor: Low Peng Wang , Mitchell Ong , Lee Choon Kuan
- Applicant: Low Peng Wang , Mitchell Ong , Lee Choon Kuan
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Priority: SG200801938-2 20080310
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K37/00
Abstract:
A wire bonding apparatus includes a processing block, a bond head assembly and an infrared radiation source for selectively heating the bond pad areas of one or more semiconductor dies and/or bonding sites on a substrate. Methods for forming wire bonds using selective heating of the bond pad areas of one or more semiconductor dies and/or bonding sites on the substrate are also disclosed.
Public/Granted literature
- US20090223937A1 APPARATUS AND METHODS FOR FORMING WIRE BONDS Public/Granted day:2009-09-10
Information query
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