Invention Grant
- Patent Title: Power distribution in a thermal ink jet printhead
- Patent Title (中): 热喷墨打印头中的功率分配
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Application No.: US13110615Application Date: 2011-05-18
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Publication No.: US08444255B2Publication Date: 2013-05-21
- Inventor: Chris Bakker , Lawrence H. White , Bjorn Warloe , Reynaldo V. Villavelez , Paul I. Mikulan , Kenneth Stewart , Michael Allen Godwin , Teck-Khim Neo , Joseph M. Torgerson , Lonnie Byers
- Applicant: Chris Bakker , Lawrence H. White , Bjorn Warloe , Reynaldo V. Villavelez , Paul I. Mikulan , Kenneth Stewart , Michael Allen Godwin , Teck-Khim Neo , Joseph M. Torgerson , Lonnie Byers
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B41J2/05
- IPC: B41J2/05
Abstract:
A thermal inkjet printhead may include a substrate and a resistive layer. A thermal resistor may be formed in the resistive layer. A first metal layer may be between the substrate and a resistive layer having a thickness to form a power bus. A dielectric layer may be between the first metal layer and the resistive layer.
Public/Granted literature
- US20120293587A1 THERMAL INK JET PRINTHEAD Public/Granted day:2012-11-22
Information query
IPC分类:
