A temperature sensor is disclosed having a measuring resistor which is accommodated inside a protective tube and a proximal end of which is connected to a sensor head. The sensor head includes a measurement insert for electrically connecting the measuring resistor and a measuring transducer which is connected downstream thereof to, for example, condition measurement signals. The sensor head is formed by a cylindrical housing having an intermediate base, the measurement insert being accommodated in a lower housing section which is adjacent to the measuring resistor and is sectioned off by the intermediate base, and the measuring transducer being accommodated in an opposite, upper housing section.