Invention Grant
- Patent Title: Camera module
- Patent Title (中): 相机模块
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Application No.: US13167204Application Date: 2011-06-23
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Publication No.: US08444331B2Publication Date: 2013-05-21
- Inventor: Masaru Kobayashi
- Applicant: Masaru Kobayashi
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-200893 20100908
- Main IPC: G03B17/48
- IPC: G03B17/48 ; H01L31/0203

Abstract:
Certain embodiments provide a camera module comprising a sensor substrate, a lens holder, a lens, and an infrared light cut filter unit. The sensor substrate has a solid-state imaging device and a light receiving unit receiving infrared light. The lens holder is mounted on the sensor substrate so as to cover the solid-state imaging device and the light receiving unit. The lens is arranged in the lens holder. The infrared light cut filter unit is arranged in the lens holder.
Public/Granted literature
- US20120057858A1 CAMERA MODULE Public/Granted day:2012-03-08
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