Invention Grant
- Patent Title: Method for attaching a connector to deposited material
- Patent Title (中): 将连接器连接到沉积材料的方法
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Application No.: US12574814Application Date: 2009-10-07
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Publication No.: US08444377B2Publication Date: 2013-05-21
- Inventor: Srikanth Chandrudu Kottilingam , Glen Alan Aussiker , Canan Uslu Hardwicke , Kurt Kramer Schleif
- Applicant: Srikanth Chandrudu Kottilingam , Glen Alan Aussiker , Canan Uslu Hardwicke , Kurt Kramer Schleif
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Cantor Colburn LLP
- Main IPC: F01B25/26
- IPC: F01B25/26
Abstract:
A method for attaching a connector to deposited material includes the steps of depositing material on a substrate using a thin- or thick-film deposition process and attaching at least one connector to the deposited material using a high energy beam welding process.
Public/Granted literature
- US20110081229A1 METHOD FOR ATTACHING A CONNECTOR TO DEPOSITED MATERIAL Public/Granted day:2011-04-07
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