Invention Grant
- Patent Title: Method for manufacturing semiconductor device and surface protective tape
- Patent Title (中): 半导体器件和表面保护带的制造方法
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Application No.: US12874659Application Date: 2010-09-02
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Publication No.: US08444799B2Publication Date: 2013-05-21
- Inventor: Hironori Fukaya , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Kazuo Teshirogi , Kazuyuki Uragou , Mika Sakamoto , Masaya Tazawa
- Applicant: Hironori Fukaya , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Kazuo Teshirogi , Kazuyuki Uragou , Mika Sakamoto , Masaya Tazawa
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Fujitsu Patent Center
- Priority: JP2009-203610 20090903
- Main IPC: B32B37/00
- IPC: B32B37/00
Abstract:
A method for manufacturing a semiconductor device includes adhering an adhesive layer of a surface protective tape including a base material film, an intermediate layer disposed on the base material film, and the adhesive layer disposed on the intermediate layer to one surface of a semiconductor substrate; curing the intermediate layer while a flat plate is pressed against the base material film of the surface protective tape; grinding the other surface of the semiconductor substrate; curing the adhesive layer; and separating the surface protective tape from the semiconductor substrate.
Public/Granted literature
- US20110048615A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SURFACE PROTECTIVE TAPE Public/Granted day:2011-03-03
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