Invention Grant
US08445177B2 Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
有权
感光性粘合剂组合物，使用该粘合剂组合物，粘合剂膜，粘合片，具有粘合剂层的半导体晶片，半导体器件和电子部件
- Patent Title: Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
- Patent Title (中): 感光性粘合剂组合物，使用该粘合剂组合物，粘合剂膜，粘合片，具有粘合剂层的半导体晶片，半导体器件和电子部件
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Application No.: US12950353Application Date: 2010-11-19
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Publication No.: US08445177B2Publication Date: 2013-05-21
- Inventor: Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
- Applicant: Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JPP2005-196328 20050705; JPP2005-332955 20051117
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/004 ; G03F7/027
Abstract:
A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
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