Disclosed is a method for manufacturing 3-dimensional structure using a thin film with a columnar nano pores and a manufacture thereof. A method for packaging an MEMS device or an NEMS device in accordance with an embodiment of the present invention includes: forming a sacrificial layer; forming a thin film having columnar nano pores formed therein by depositing one of a metallic material, an oxide, a nitride and a fluoride on the sacrificial layer; forming a support layer on the thin film and patterning the support layer; removing the sacrificial layer through use of the nano pores of the thin film parts of which are exposed by patterning the support layer; and forming a shielding layer on the thin film and the support layer.