The invention relates to a method for producing chip elements provided with a groove, comprising the following steps: on an interconnect substrate, providing a conductive track arranged to connect a contact area of an active surface of a chip to an area corresponding to a first wall of the groove; growing a contact bump by electrodeposition on the conductive track at the level of the area corresponding to the first wall of the groove; assembling the chip on the substrate via its active surface so that a side wall of the chip forms the bottom of the groove; machining the chip via its rear surface in parallel to the substrate while measuring the distance between the rear surface of the chip and the contact bump; stopping machining when the measured distance reaches a required value; and assembling by bonding a plate to the rear surface of the chip so as to form a second wall of the groove.