Invention Grant
US08445333B2 Method of forming polysilicon, thin film transistor using the polysilicon, and method of fabricating the thin film transistor
有权
使用多晶硅形成多晶硅的方法,使用该多晶硅的薄膜晶体管,以及制造该薄膜晶体管的方法
- Patent Title: Method of forming polysilicon, thin film transistor using the polysilicon, and method of fabricating the thin film transistor
- Patent Title (中): 使用多晶硅形成多晶硅的方法,使用该多晶硅的薄膜晶体管,以及制造该薄膜晶体管的方法
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Application No.: US12929587Application Date: 2011-02-02
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Publication No.: US08445333B2Publication Date: 2013-05-21
- Inventor: Jun-Hee Choi , Andrei Zoulkarneev
- Applicant: Jun-Hee Choi , Andrei Zoulkarneev
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2007-0003070 20070110
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/84 ; H01L21/20

Abstract:
A method of forming polysilicon, a thin film transistor (TFT) using the polysilicon, and a method of fabricating the TFT are disclosed. The method of forming the polysilicon comprises: forming an insulating layer on a substrate; forming a first electrode and a second electrode on the insulating layer; forming at least one heater layer on the insulating layer so as to connect the first electrode and the second electrode; forming an amorphous material layer containing silicon on the heater layer(s); forming a through-hole under the heater layer(s) by etching the insulating layer; and crystallizing the amorphous material layer into a polysilicon layer by applying a voltage between the first electrode and the second electrode so as to heat the heater layer(s).
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