Invention Grant
US08445351B2 Floating-gate nonvolatile semiconductor memory device and method of making 有权
浮栅非易失性半导体存储器件及其制造方法

  • Patent Title: Floating-gate nonvolatile semiconductor memory device and method of making
  • Patent Title (中): 浮栅非易失性半导体存储器件及其制造方法
  • Application No.: US13255240
    Application Date: 2011-01-04
  • Publication No.: US08445351B2
    Publication Date: 2013-05-21
  • Inventor: Dongping WuShi-Li Zhang
  • Applicant: Dongping WuShi-Li Zhang
  • Applicant Address: CN Shanghai
  • Assignee: Fudan University
  • Current Assignee: Fudan University
  • Current Assignee Address: CN Shanghai
  • Agent Jamie J. Zheng, Esq.
  • Priority: CN201010022877 20100115
  • International Application: PCT/CN2011/000016 WO 20110104
  • International Announcement: WO2011/085637 WO 20110721
  • Main IPC: H01L21/336
  • IPC: H01L21/336 H01L21/338 H01L21/8238 H01L21/425
Floating-gate nonvolatile semiconductor memory device and method of making
Abstract:
The present invention provides a floating-gate non-volatile semiconductor memory device and a method of making the same. The floating-gate non-volatile semiconductor memory device comprises a semiconductor substrate, a source, a drain, a first insulator layer, a first polysilicon layer, a second insulator layer, a second polysilicon layer, a protective layer and sidewalls. The source and drain are disposed on the semiconductor substrate. The first insulator layer is disposed over a region of the semiconductor substrate other than regions corresponding to the source and drain. The first polysilicon layer is disposed over the first insulator layer, forming a floating gate. The second insulator layer is disposed over the first polysilicon layer. The second polysilicon layer is disposed over the second insulator layer, forming a control gate and a wordline. The sidewalls are disposed on two sides of the wordline, and the protective layer is disposed over the second polysilicon layer. A semiconductor junction at a drain region is a P-N junction, while a semiconductor junction at a source region is a metal-semiconductor junction.
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