Invention Grant
- Patent Title: Methods of treating semiconducting materials including melting and cooling
- Patent Title (中): 处理半导体材料的方法包括熔化和冷却
-
Application No.: US12156499Application Date: 2008-06-02
-
Publication No.: US08445364B2Publication Date: 2013-05-21
- Inventor: Prantik Mazumder , Kamal Kishore Soni , Christopher Scott Thomas , Natesan Venkataraman , Glen Bennett Cook
- Applicant: Prantik Mazumder , Kamal Kishore Soni , Christopher Scott Thomas , Natesan Venkataraman , Glen Bennett Cook
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Michael W. Russell
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/36 ; H01L33/00 ; C23C16/54 ; C30B15/14
Abstract:
A method for treating semiconducting materials includes providing a semiconducting material having a crystalline structure, pre-heating a portion of the semiconducting material to a temperature less than the melting temperature of the semiconducting material, and then cooling the semiconducting material prior to exposing at least the portion of the semiconducting material to a heat source to create a melt pool, and cooling the semiconducting material.
Public/Granted literature
- US20090297395A1 Methods of treating semiconducting materials and treated semiconducting materials Public/Granted day:2009-12-03
Information query
IPC分类:
