Invention Grant
US08445378B2 Method of manufacturing a CMOS device including molecular storage elements in a via level
有权
制造包括通孔级分子存储元件的CMOS器件的方法
- Patent Title: Method of manufacturing a CMOS device including molecular storage elements in a via level
- Patent Title (中): 制造包括通孔级分子存储元件的CMOS器件的方法
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Application No.: US12839455Application Date: 2010-07-20
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Publication No.: US08445378B2Publication Date: 2013-05-21
- Inventor: Stephan Kronholz , Markus Lenski , Ralf Richter
- Applicant: Stephan Kronholz , Markus Lenski , Ralf Richter
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Williams, Morgan & Amerson, P.C.
- Priority: DE102009035419 20090731
- Main IPC: H01L21/768
- IPC: H01L21/768

Abstract:
Memory cells in integrated circuit devices may be formed on the basis of functional molecules which may be positioned within via openings on the basis of appropriate patterning techniques, which may also be used for forming semiconductor-based integrated circuits. Consequently, memory cells may be formed on a “molecular” level without requiring extremely sophisticated patterning regimes, such as electron beam lithography and the like.
Public/Granted literature
- US20110024912A1 CMOS DEVICE INCLUDING MOLECULAR STORAGE ELEMENTS IN A VIA LEVEL Public/Granted day:2011-02-03
Information query
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