Invention Grant
- Patent Title: Laser welding apparatus
- Patent Title (中): 激光焊接设备
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Application No.: US12903855Application Date: 2010-10-13
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Publication No.: US08445810B2Publication Date: 2013-05-21
- Inventor: Hisashi Hozumi , Yutaka Togasawa , Kenji Matsuzaki , Mitsuaki Shimamura , Satoshi Okada , Wataru Kono , Masaki Yoda
- Applicant: Hisashi Hozumi , Yutaka Togasawa , Kenji Matsuzaki , Mitsuaki Shimamura , Satoshi Okada , Wataru Kono , Masaki Yoda
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2008-104846 20080414
- Main IPC: B23K26/20
- IPC: B23K26/20

Abstract:
According to one embodiment, a laser welding apparatus has a laser irradiation head that is arranged in an outer frame and is divided inside into a light source side and an irradiation side by a partitioning member. The apparatus also has a gas jet nozzle that is formed so as to irradiate a portion to be welded with the laser light and jet the inert gas to the portion to be welded; and a welding wire feed pipe that sequentially feeds a welding wire. The apparatus also has a welding wire contact mechanism that includes a measuring means for measuring a distance between the extremity of the irradiation side and the extremity of the welding wire, and is formed so that the extremity of the welding wire is brought into contact with and pressed against the portion to be welded by an elastic member.
Public/Granted literature
- US20110024402A1 LASER WELDING APPRATUS AND LASER WELDING METHOD Public/Granted day:2011-02-03
Information query
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