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US08445827B2 Multi-wiring layer solid-state imaging device with increased sensitivity, electronic apparatus, and method for manufacturing same 有权
具有增加灵敏度的多层布线层固态成像装置，电子设备及其制造方法

Multi-wiring layer solid-state imaging device with increased sensitivity, electronic apparatus, and method for manufacturing same
Abstract:
A solid state imaging device is described that includes a semiconductor substrate having a plurality of photodiodes thereon. The solid state imaging device further includes a first wiring portion, a second wiring portion and a third wiring portion. The device further includes a first wiring layer over the semiconductor substrate and which includes a plurality of metal films and extends across all the wiring portions. Additionally, a second wiring layer is disposed over the first wiring layer and which extends across the first wiring portion and the second wiring portion.
Abstract(Chinese):

描述了一种固态成像装置，其包括其上具有多个光电二极管的半导体衬底。 固态成像装置还包括第一布线部分，第二布线部分和第三布线部分。 该器件还包括半导体衬底上的第一布线层，并且包括多个金属膜并延伸穿过所有布线部分。 此外，第二布线层设置在第一布线层之上并且延伸穿过第一布线部分和第二布线部分。

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