Invention Grant
US08445926B2 LED package, method of fabricating the same, and backlight unit having the same
有权
LED封装，其制造方法和具有该LED封装的背光单元
- Patent Title: LED package, method of fabricating the same, and backlight unit having the same
- Patent Title (中): LED封装，其制造方法和具有该LED封装的背光单元
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Application No.: US11995649Application Date: 2006-12-28
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Publication No.: US08445926B2Publication Date: 2013-05-21
- Inventor: Jun Seok Park , Yong Seok Choi
- Applicant: Jun Seok Park , Yong Seok Choi
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2006-0001534 20060106
- International Application: PCT/KR2006/005808 WO 20061228
- International Announcement: WO2007/078103 WO 20070712
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
Disclosed are a LED package, a method of fabricating the same, and a backlight unit having the same. The light emitting diode package comprises a light emitting diode, a printed circuit board provided with a circuit pattern used for driving the light emitting diode and a through hole formed in an area where the light emitting diode is mounted, and a heat sink provided in the through hole and contacted with a bottom surface of the light emitting diode.
Public/Granted literature
- US20080191231A1 Led Package, Method Of Fabricating The Same, And Backlight Unit Having The Same Public/Granted day:2008-08-14
Information query
IPC分类:
