Invention Grant
- Patent Title: Conductive film, and transducer and flexible wiring board using the same
- Patent Title (中): 导电膜,换能器和使用其的柔性布线板
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Application No.: US13359037Application Date: 2012-01-26
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Publication No.: US08446075B2Publication Date: 2013-05-21
- Inventor: Wataru Takahashi , Hitoshi Yoshikawa , Jun Kobayashi
- Applicant: Wataru Takahashi , Hitoshi Yoshikawa , Jun Kobayashi
- Applicant Address: JP Aichi-Ken
- Assignee: Tokai Rubber Industries, Ltd.
- Current Assignee: Tokai Rubber Industries, Ltd.
- Current Assignee Address: JP Aichi-Ken
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2010-115015 20100519
- Main IPC: H01L41/047
- IPC: H01L41/047

Abstract:
To provide a conductive film that is flexible, extendable and contractible, and for which the electrical resistance hardly increases even when the conductive film is extended. The conductive film contains an elastomer and metallic filler particles, and satisfies a condition (A) [an average value of reference numbers is 0.8 (1/μm) or more, or the metallic filler particles include flake-like metallic filler particles having a thickness of 1 μm or less and an aspect ratio of 26 or more and the average value of the reference numbers is 0.4 (1/μm) or more] and a condition (B) [a number of unit areas for which an area percentage of the elastomer is 60% or more is 20 or more], the condition (A) being a conductivity indicator and the condition (B) being a flexibility indicator.
Public/Granted literature
- US20120119626A1 CONDUCTIVE FILM, AND TRANSDUCER AND FLEXIBLE WIRING BOARD USING THE SAME Public/Granted day:2012-05-17
Information query
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