Invention Grant
- Patent Title: Semiconductor device and method of forming same for temperature compensating active resistance
- Patent Title (中): 半导体器件及其形成温度补偿有源电阻的方法
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Application No.: US13305530Application Date: 2011-11-28
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Publication No.: US08446209B1Publication Date: 2013-05-21
- Inventor: Pavel Horsky , Michal Olsak
- Applicant: Pavel Horsky , Michal Olsak
- Applicant Address: US AZ Phoenix
- Assignee: Semiconductor Components Industries, LLC
- Current Assignee: Semiconductor Components Industries, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Patents on Demand, P.A.
- Agent Scott M. Garret; Brian K. Buchheit
- Main IPC: H01L35/00
- IPC: H01L35/00

Abstract:
In an embodiment a circuit provides an active resistance that is adjusted with temperature, the active resistance has a magnitude and temperature coefficient that is selected by the values of external resistors. The active resistance is controlled by an active resistance controller that uses a temperature dependent source and a temperature stable source to control adjustment of a first adjustable resistance to maintain correspondence between a temperature dependent parameter and a temperature stable parameter, and adjusts a second adjustable resistance that is part of the active resistance in correspondence with adjustment of the first adjustable resistance.
Public/Granted literature
- US20130135032A1 SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME FOR TEMPERATURE COMPENSATING ACTIVE RESISTANCE Public/Granted day:2013-05-30
Information query
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