Invention Grant
- Patent Title: Flexible printed circuit and electric circuit structure
- Patent Title (中): 柔性印刷电路和电路结构
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Application No.: US13000615Application Date: 2009-06-24
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Publication No.: US08446556B2Publication Date: 2013-05-21
- Inventor: Teruo Kawamura , Toshio Etoh
- Applicant: Teruo Kawamura , Toshio Etoh
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Chen Yoshimura LLP
- Priority: JP2008-178299 20080708
- International Application: PCT/JP2009/061505 WO 20090624
- International Announcement: WO2010/004875 WO 20100114
- Main IPC: G02F1/1345
- IPC: G02F1/1345

Abstract:
Provided are a flexible printed circuit that reduces the chance of the occurrence of short-circuit failures caused by swarf generated from punching out flexible printed circuit, and an electric circuit structure having this flexible printed circuit and an electric circuit substrate to which the flexible printed circuit is connected. A flexible printed circuit (100) has a wiring pattern (2) formed on the flexible base film (1). The flexible printed circuit (100) is individually punched out to be separated in a condition where the wiring pattern (2) is disposed on the base film (1), and the wiring pattern (2) has a narrowed portion (2c) near the edge of the base film (1).
Public/Granted literature
- US20110102729A1 FLEXIBLE PRINTED CIRCUIT AND ELECTRIC CIRCUIT STRUCTURE Public/Granted day:2011-05-05
Information query
IPC分类: