Invention Grant
- Patent Title: In-wall mounted housing for electronic components
- Patent Title (中): 用于电子元件的壁挂式外壳
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Application No.: US12884484Application Date: 2010-09-17
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Publication No.: US08446737B1Publication Date: 2013-05-21
- Inventor: David Tschirpke
- Applicant: David Tschirpke
- Agency: Mirick, O'Connell, DeMallie + Lougee, LLP
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H05K7/18

Abstract:
An in-wall mounted housing or enclosure for an electronic apparatus, such as used as part of a wireless sound system, is configured with a relatively large volume chamber which requires a limited size cut-out for installation. With such a configuration, the enclosure can be mounted within a wall, ceiling, or floor structure while having a sufficient volume to contain all of the required electrical components for a particular application, such as in a wireless sound system. In one arrangement, the housing is configured with two or more chambers where each chamber contains a distinct electrical component. Separation of certain electrical components into distinct chambers can minimize electrical interference between the components during operation. In one arrangement, the housing is further configured to carry both low voltage and high voltage components within the separate chambers while minimizing electrical interference among the components.
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