Invention Grant
US08446740B2 Frame reinforcing structure and electronic apparatus including the structure
有权
框架加固结构和包括该结构在内的电子设备
- Patent Title: Frame reinforcing structure and electronic apparatus including the structure
- Patent Title (中): 框架加固结构和包括该结构在内的电子设备
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Application No.: US12517976Application Date: 2007-11-30
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Publication No.: US08446740B2Publication Date: 2013-05-21
- Inventor: Takaya Yoshida
- Applicant: Takaya Yoshida
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2006-332667 20061208
- International Application: PCT/JP2007/073256 WO 20071130
- International Announcement: WO2008/069152 WO 20080612
- Main IPC: H02B1/01
- IPC: H02B1/01 ; H05K1/14 ; H05K5/00 ; H04M1/00

Abstract:
Even in a location where, for example, a notch section is formed, sufficient rigidity is secured. For this purpose, in reinforcing structure of a front case, a horizontal hemming-bent section 18 formed by folding work is disposed not only in a notch section 9, but also in regions near neighborhood regions 15 and 16. As a result, in the neighborhood regions 15 and 16 of the notch section 9, there is formed a location in which the horizontal hemming-bent section 18 overlaps with a sidewall section 7 along a side end edge to thereby provide reinforcement. Hence, also in the notch section 9, sufficient rigidity is secured.
Public/Granted literature
- US20090268424A1 FRAME REINFORCING STRUCTURE AND ELECTRONIC APPARATUS INCLUDING THE STRUCTURE Public/Granted day:2009-10-29
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