Invention Grant
US08446740B2 Frame reinforcing structure and electronic apparatus including the structure 有权
框架加固结构和包括该结构在内的电子设备

  • Patent Title: Frame reinforcing structure and electronic apparatus including the structure
  • Patent Title (中): 框架加固结构和包括该结构在内的电子设备
  • Application No.: US12517976
    Application Date: 2007-11-30
  • Publication No.: US08446740B2
    Publication Date: 2013-05-21
  • Inventor: Takaya Yoshida
  • Applicant: Takaya Yoshida
  • Applicant Address: JP Tokyo
  • Assignee: NEC Corporation
  • Current Assignee: NEC Corporation
  • Current Assignee Address: JP Tokyo
  • Priority: JP2006-332667 20061208
  • International Application: PCT/JP2007/073256 WO 20071130
  • International Announcement: WO2008/069152 WO 20080612
  • Main IPC: H02B1/01
  • IPC: H02B1/01 H05K1/14 H05K5/00 H04M1/00
Frame reinforcing structure and electronic apparatus including the structure
Abstract:
Even in a location where, for example, a notch section is formed, sufficient rigidity is secured. For this purpose, in reinforcing structure of a front case, a horizontal hemming-bent section 18 formed by folding work is disposed not only in a notch section 9, but also in regions near neighborhood regions 15 and 16. As a result, in the neighborhood regions 15 and 16 of the notch section 9, there is formed a location in which the horizontal hemming-bent section 18 overlaps with a sidewall section 7 along a side end edge to thereby provide reinforcement. Hence, also in the notch section 9, sufficient rigidity is secured.
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