Invention Grant
- Patent Title: Substrate processing apparatus, substrate processing method, and storage medium
- Patent Title (中): 基板处理装置,基板处理方法和存储介质
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Application No.: US12896236Application Date: 2010-10-01
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Publication No.: US08447422B2Publication Date: 2013-05-21
- Inventor: Masahiro Yoshida , Kouji Takuma
- Applicant: Masahiro Yoshida , Kouji Takuma
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2009-231969 20091005
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
Disclosed are a substrate processing apparatus, a substrate processing method, and a storage medium, which can process a normal substrate according to a normal schedule in parallel with a substrate to be processed in preference to other substrates. Processing block performs the same types of processes for substrates, carried therein from FOUP placing unit, by using process arms. When a priority substrate having a priority over other substrates are carried, control unit carries and processes the priority substrate in priority processing unit that can receive a next substrate among priority processing units to which a plurality of processing units are partially or wholly assigned, in preference to other substrates.
Public/Granted literature
- US20110082579A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM Public/Granted day:2011-04-07
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