Invention Grant
- Patent Title: Thin film transistor substrate and manufacturing method thereof
- Patent Title (中): 薄膜晶体管基板及其制造方法
-
Application No.: US13231225Application Date: 2011-09-13
-
Publication No.: US08450129B2Publication Date: 2013-05-28
- Inventor: Hong-Kee Chin , Sang-Gab Kim , Woong-Kwon Kim , Yong-Mo Choi , Seung-Ha Choi , Shin-Il Choi , Ho-Jun Lee , Jung-Suk Bang , Yu-Gwang Jeong
- Applicant: Hong-Kee Chin , Sang-Gab Kim , Woong-Kwon Kim , Yong-Mo Choi , Seung-Ha Choi , Shin-Il Choi , Ho-Jun Lee , Jung-Suk Bang , Yu-Gwang Jeong
- Applicant Address: KR
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2008-0128494 20081217
- Main IPC: H01L33/16
- IPC: H01L33/16

Abstract:
A thin film transistor (TFT) substrate is provided in which a sufficiently large contact area between conductive materials is provided in a contact portion and a method of fabricating the TFT substrate. The TFT substrate includes a gate interconnection line formed on an insulating substrate, a gate insulating layer covering the gate interconnection line, a semiconductor layer arranged on the gate insulating layer, a data interconnection line including a data line, a source electrode and a drain electrode formed on the semiconductor layer, a first passivation layer formed on the data interconnection line and exposing the drain electrode, a second passivation layer formed on the first passivation film and a pixel electrode electrically connected to the drain electrode. An outer sidewall of the second passivation layer is positioned inside an outer sidewall of the first passivation layer.
Public/Granted literature
- US20120003768A1 THIN FLIM TRANSISTOR SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-01-05
Information query
IPC分类: