Invention Grant
- Patent Title: Integrated circuit with grating and manufacturing method therefor
- Patent Title (中): 具有光栅的集成电路及其制造方法
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Application No.: US13119370Application Date: 2009-09-12
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Publication No.: US08450823B2Publication Date: 2013-05-28
- Inventor: Erwin Hijzen , Magali Lambert
- Applicant: Erwin Hijzen , Magali Lambert
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP08105358 20080916
- International Application: PCT/IB2009/053994 WO 20090912
- International Announcement: WO2010/032187 WO 20100325
- Main IPC: H01L31/0232
- IPC: H01L31/0232 ; H01L21/00

Abstract:
Disclosed is an integrated circuit (100) comprising a substrate (110) carrying a plurality of light-sensitive elements (112) and a blazed grating (120) comprising a plurality of diffractive elements (122) for diffracting respective spectral components (123-125) of incident light (150) to respective light-sensitive elements (112), the blazed grating (120) comprising a stack of layers, at least some of these layers comprising first portions, e.g. metal portions (202, 222, 242) arranged such that each diffractive element (122) comprises a stepped profile of stacked first portions with a first portion in a higher layer laterally extending beyond a first portion in a lower layer of said stepped profile.
Public/Granted literature
- US20110169120A1 INTEGRATED CIRCUIT WITH GRATING AND MANUFACTURING METHOD THEREFOR Public/Granted day:2011-07-14
Information query
IPC分类: