Invention Grant
- Patent Title: MOS varactor structure and methods
- Patent Title (中): MOS变容二极管的结构和方法
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Application No.: US13013677Application Date: 2011-01-25
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Publication No.: US08450827B2Publication Date: 2013-05-28
- Inventor: Chi-Feng Huang , Chia-Chung Chen
- Applicant: Chi-Feng Huang , Chia-Chung Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/36
- IPC: H01L21/36

Abstract:
Apparatus and methods for a MOS varactor structure are disclosed An apparatus is provided, comprising an active area defined in a portion of a semiconductor substrate; a doped well region in the active area extending into the semiconductor substrate; at least two gate structures disposed in parallel over the doped well region; source and drain regions disposed in the well region formed on opposing sides of the gate structures; a gate connector formed in a first metal layer overlying the at least two gate structures and electrically coupling the at least two gate structures; source and drain connectors formed in a second metal layer and electrically coupled to the source and drain regions; and interlevel dielectric material separating the source and drain connectors in the second metal layer from the gate connector formed in the first metal layer. Methods for forming the structure are disclosed.
Public/Granted literature
- US20120187494A1 MOS Varactor Structure and Methods Public/Granted day:2012-07-26
Information query
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