Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12339702Application Date: 2008-12-19
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Publication No.: US08450828B2Publication Date: 2013-05-28
- Inventor: Eisuke Suekawa
- Applicant: Eisuke Suekawa
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-195062 20080729
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/06

Abstract:
A semiconductor device includes a semiconductor substrate of a first conductivity type, including a first main surface and a second main surface opposite to each other. A power semiconductor element includes a first electrode in a first region at the first main surface of the semiconductor substrate, and a second electrode at the second main surface. A current flows between the first electrode and the second electrode. The semiconductor device also includes a guard ring of a second conductivity type, in a second region at the first main surface, at a more outer circumference than the first region. A semi-insulating insulation film covers the second region. A dielectric film in the second region covers the semi-insulating insulation film. A flow block portion in a third region at the first main surface, at a more outer circumference than the second region, prevents a flow out of the dielectric film.
Public/Granted literature
- US20100025820A1 SEMICONDUCTOR DEVICE Public/Granted day:2010-02-04
Information query
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