Invention Grant
- Patent Title: Circuit device having an improved heat dissipitation, and the method of manufacturing the same
- Patent Title (中): 具有改善的散热的电路装置及其制造方法
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Application No.: US13240870Application Date: 2011-09-22
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Publication No.: US08450837B2Publication Date: 2013-05-28
- Inventor: Shigeki Mashimo , Fumio Horiuchi , Kiyoaki Kudo , Akira Sakurai , Yuhki Inagaki
- Applicant: Shigeki Mashimo , Fumio Horiuchi , Kiyoaki Kudo , Akira Sakurai , Yuhki Inagaki
- Applicant Address: BM Hamilton
- Assignee: ON Semiconductor Trading, Ltd.
- Current Assignee: ON Semiconductor Trading, Ltd.
- Current Assignee Address: BM Hamilton
- Agency: Morrison & Foerster LLP
- Priority: JP2010-213693 20100924
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/60
Abstract:
In a hybrid integrated circuit device, a circuit board on which an island portion of a lead is fixedly attached and a control board on which a control element and the like are mounted are disposed in an overlapping manner. The circuit board and the control board are integrally encapsulated with an encapsulating resin. A transistor disposed on an upper surface of the circuit board and a control element mounted on an upper surface of the control board are also covered by the encapsulating resin. Thus, a module in which an inverter circuit and a control circuit are integrally encapsulated with resin is provided.
Public/Granted literature
- US20120074552A1 CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-03-29
Information query
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