Invention Grant
- Patent Title: Thermal foldback control for a light-emitting diode
- Patent Title (中): 用于发光二极管的热折返控制
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Application No.: US12977775Application Date: 2010-12-23
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Publication No.: US08450948B2Publication Date: 2013-05-28
- Inventor: Pei-Cheng Huang , Jing-Meng Liu
- Applicant: Pei-Cheng Huang , Jing-Meng Liu
- Applicant Address: TW Hsinchu
- Assignee: Richtek Technology Corp.
- Current Assignee: Richtek Technology Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Rosenberg, Klein & Lee
- Priority: TW99100122A 20100105
- Main IPC: G05F1/00
- IPC: G05F1/00
Abstract:
By monitoring the temperature of an LED and the temperature of a controller chip for the LED, a thermal foldback control is employed to gradually decrease the driving current of the LED before the LED or the controller chip is over heated, so as to prevent an over temperature protection from being triggered to shutdown the controller chip to cause the LED to undesirably flicker.
Public/Granted literature
- US20110163696A1 THERMAL FOLDBACK CONTROL FOR A LIGHT-EMITTING DIODE Public/Granted day:2011-07-07
Information query
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