Invention Grant
- Patent Title: Coil component and method of manufacturing the same
- Patent Title (中): 线圈部件及其制造方法
-
Application No.: US13149114Application Date: 2011-05-31
-
Publication No.: US08451083B2Publication Date: 2013-05-28
- Inventor: Takeshi Okumura , Tomokazu Ito
- Applicant: Takeshi Okumura , Tomokazu Ito
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2010-124262 20100531; JP2011-120949 20110530; JP2011-120950 20110530
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28

Abstract:
A coil component is provided with a magnetic substrate made of magnetic ceramic material, a thin-film coil layer containing a coil conductor formed on one principal surface of the magnetic substrate, a plurality of bump electrodes formed on the principal surface of the thin-film coil layer, and an insulating resin layer formed on the principal surface of the thin-film coil layer excluding formation positions of the bump electrodes. Each bump electrode has an exposure surface on a bottom surface and on two side surfaces of a layered product composed of the magnetic substrate, the thin-film coil layer and the insulating resin layer. A corner of the each bump electrode has a notch portion. The insulating resin layer includes a center resin portion provided in a center of the principal surface of the thin-film coil layer and a plurality of corner resin portions provided in the notch portion of each bump electrode.
Public/Granted literature
- US20110291790A1 COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-12-01
Information query