Invention Grant
- Patent Title: Semiconductor device with signal lines and shield lines
- Patent Title (中): 具有信号线和屏蔽线的半导体器件
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Application No.: US12605688Application Date: 2009-10-26
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Publication No.: US08451676B2Publication Date: 2013-05-28
- Inventor: Hidekazu Egawa
- Applicant: Hidekazu Egawa
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2008-278797 20081029
- Main IPC: G11C7/02
- IPC: G11C7/02

Abstract:
A semiconductor device may include, but is not limited to, a first signal line, a second signal line, and a first shield line. The first signal line is supplied with a first signal. The first signal is smaller in amplitude than a potential difference between a power potential and a reference potential. The second signal line is disposed in a first side of the first signal line. The second signal line is supplied with a second signal. The second signal is smaller in amplitude than the potential difference. The first shield line is disposed in a second side of the first signal line. The second side is opposite to the first side. The first shield line reduces a coupling noise that is applied to the first shield line from the second side.
Public/Granted literature
- US20100103757A1 SEMICONDUCTOR DEVICE Public/Granted day:2010-04-29
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