Invention Grant
- Patent Title: Sub-packet pulse-based communications
- Patent Title (中): 子包脉冲通信
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Application No.: US11740815Application Date: 2007-04-26
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Publication No.: US08451710B2Publication Date: 2013-05-28
- Inventor: Chong U. Lee , Amal Ekbal , David Jonathan Julian
- Applicant: Chong U. Lee , Amal Ekbal , David Jonathan Julian
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Paul S. Holdaway
- Main IPC: H04J7/00
- IPC: H04J7/00

Abstract:
Low power wireless communication techniques may be employed in devices that communicate via a wireless body area network, a wireless personal area network, or some other type of wireless communication link. In some implementations the devices may communicate via one or more impulse-based ultra-wideband channels. Inter-pulse duty cycling may be employed to reduce the power consumption of a device. Power may be provided for the transmissions and receptions of pulses by charging and discharging a capacitive element according to the inter-pulse duty cycling. Sub-packet data may be transmitted and received via a common frequency band. A cell phone may multicast to two or more peripherals via wireless communication links.
Public/Granted literature
- US20070291684A1 SUB-PACKET PULSE-BASED COMMUNICATIONS Public/Granted day:2007-12-20
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