Invention Grant
- Patent Title: CMOS compatible microneedle structures
- Patent Title (中): CMOS兼容微针结构
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Application No.: US12043285Application Date: 2008-03-06
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Publication No.: US08452369B2Publication Date: 2013-05-28
- Inventor: Roeland Huys , Carmen Bartic , Josine Loo
- Applicant: Roeland Huys , Carmen Bartic , Josine Loo
- Applicant Address: BE Leuven BE Leuven
- Assignee: IMEC,Katholieke Universiteit Leuven, K.U. Leuven R&D
- Current Assignee: IMEC,Katholieke Universiteit Leuven, K.U. Leuven R&D
- Current Assignee Address: BE Leuven BE Leuven
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Main IPC: A61B5/04
- IPC: A61B5/04

Abstract:
The present invention provides an electronic device for sensing and/or actuating, the electronic device comprising at least one microneedle (10) on a substrate (1), each of the microneedles (10) comprising at least one channel (7, 8) surrounded by an insulating layer (6). The present invention also provides a method for making such an electronic device for sensing and/or actuating.
Public/Granted literature
- US20080319298A1 CMOS Compatible Microneedle Structures Public/Granted day:2008-12-25
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