Invention Grant
- Patent Title: Encapsulated and vented particulate thermal insulation
- Patent Title (中): 密封和通风的颗粒保温
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Application No.: US11511060Application Date: 2006-08-25
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Publication No.: US08453393B2Publication Date: 2013-06-04
- Inventor: Alberto E. Schroth , Jimmy L. Clark , Michael Doan , David M. La Komski , Shannon O. White , Stephen E. Smith , Christopher M. Shaffer , Wilfried Krone-Schmidt
- Applicant: Alberto E. Schroth , Jimmy L. Clark , Michael Doan , David M. La Komski , Shannon O. White , Stephen E. Smith , Christopher M. Shaffer , Wilfried Krone-Schmidt
- Applicant Address: US MA Waltham US MA Northborough
- Assignee: Raytheon Company,Aspen Aerogels, Inc.
- Current Assignee: Raytheon Company,Aspen Aerogels, Inc.
- Current Assignee Address: US MA Waltham US MA Northborough
- Agency: Thorpe North & Western LLP
- Main IPC: E06B7/12
- IPC: E06B7/12 ; B32B1/04 ; B32B3/02
Abstract:
An article includes a piece of encapsulated insulation including an envelope having at least two vents therethrough, a particulate insulation within the envelope, and a porous filter overlying each vent of the envelope. The porous filter has a mesh size no larger that the minimum size of the particles. The article may further include a structure having a structure surface, and the piece of encapsulated insulation overlies and covers at least a portion of the structure surface.
Public/Granted literature
- US20080057334A1 Encapsulated and vented particulate thermal insulation Public/Granted day:2008-03-06
Information query
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